About to ICICAP 2025
With the rapid development of information technology, integrated circuits, as the core components of modern electronic devices, play an irreplaceable role in promoting social and economic development through technological progress. At the same time, research achievements in the field of applied physics provide a solid theoretical foundation and technical support for the design, manufacturing, and optimization of integrated circuits. In order to promote the deep integration and innovative development of these two key fields, the 2025 International Conference on Integrated Circuits and Applied Physics will be held grandly in Chengdu, China. The purpose of this conference is to gather top scientists, engineers, scholars, and industry experts from around the world to discuss the latest developments and future trends in integrated circuit design, manufacturing processes, materials science, and applied physics. The conference will pay special attention to cutting-edge fields such as Very Large Scale Integration (VLSI), Radio Frequency Integrated Circuit (RFID), Power Management Integrated Circuit (PMIC), Quantum Computing, Sensor Technology, Micro Nano Electromechanical Systems (MEMS/NEMS), and discuss in depth the practical applications of these technologies in industries such as communication, healthcare, automotive, and consumer electronics. The conference has set up various forms of communication, including keynote speeches, special seminars, paper presentations, and poster displays, aiming to provide an open and interactive academic exchange platform for participants. In addition, a special forum for young scholars has been established to encourage and support the younger generation of researchers to share their innovative achievements and inspire new research inspirations. Through this conference, we hope to not only deepen our understanding of integrated circuit technology and applied physics, but also promote interdisciplinary cooperation and knowledge sharing, accelerating the pace of transforming scientific and technological achievements into productivity. At the same time, we also look forward to this conference becoming a bridge connecting academia and industry, promoting the integration of industry, academia, and research, and helping to build a more intelligent and efficient future society. We cordially invite professionals from both domestic and international fields engaged in research on integrated circuits and related fields to gather in Chengdu and participate in this technological feast, exploring the beautiful prospects intertwined between integrated circuits and applied physics. Let's work hand in hand to create a new era of technology!
Record
All full paper submissions to the ICICAP 2025 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of ICICAP 2025 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
Submission Portal
Mail Address: icicap@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;

- 白老师
- TEL:19522126617 (微信同号)
- QQ:2784981077
- E-mail:icicap@sub-paper.com
Important Dates
Submission Deadline:2025-06-01
Registration Deadline:2025-06-08
Conference Date:2025-06-15
Notification Date:About a week after the submission
CALL FOR PAPERS
Integrated circuit: VLSI Design and Manufacturing Semiconductor devices and circuits Parallel And Distributed Computing Measurement technology and instruments Testing and Reliability Communication Theory and Systems Sensors and Sensor Networks single chip microcomputer GIs Low power consumption and acquisition technology electromagnetic compatibility Electric Vehicle Technology electric engineering Electric motors and appliances Power Electronics and Its Applications Power and energy circuits Power system and its automation Reliability and safety of power system Power system communication Circuit simulation & modeling Circuits and Systems Power Quality and Electromagnetic Compatibility Computational Intelligence in Electrical Engineering Electronic Design Automation Multimedia Systems and Signal Processing Biomimetic Information Processing Methods and Technologies Distributed power generation, fuel cells, and renewable energy systems High voltage and insulation technology optoelectronics process control Mechatronics and Robotics Applied Physics: Condensed Matter Physics and New Materials Physics and Applied Physics Nuclear physics, acoustic/electrical/optical/thermal atomic physics Solid State Physics Structure and physical properties Electrical and Electronic Technology semiconductor physics optoelectronics Optoelectronic Technology and Its Applications Nuclear Electronics Nuclear Technology and Applications Vibration, Noise and Their Control Electroacoustic Technology Circuit Principles and Analysis Quantum Electronic Informatics Photonics informatics Space Science and Technology
..... View more themes>>About Plagiarism Check
Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.
Indexing Service





中文特别声明
出版社在论文出版前会对论文重复率进行检测,重复率大于20%的稿件将被拒绝出版;重复率不大于20%的稿件中,如有整段大面积的直接复制其他作者文章内容的情况,也会被拒绝出版。以上两种涉及抄袭的情况,一旦被出版社证实,文章将被拒绝出版,并且不退回任何会议注册费用。
Technical Sponsor




Submission Guidelines
Submit
Please submit the full text/abstract
of the paper to us through the elec
tronic submission system
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (icicap@sub-paper.com) if you are interested in it.
SCI JOURNAL
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to icicap@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.